Three-Dimensional Transient Electro-Thermal Simulation
نویسندگان
چکیده
We present a program package based on finite elements for twoand three-dimensional analysis of interconnect structures. Thereby, triangular and tetrahedral grid elements with quadratic shape functions are used. Two preprocessors allow a layer-based input of the simulation geometry and the specification of the boundary conditions. The main program calculates amongst other things the distribution of the electric potential, the temperature and the current density. It can be applied for optimization of interconnect structures as well as for studies to verify the reliability of interconnects, as phenomena like electromigration are closely related to temperature and current density. As application example the analysis of a contact chain structure is presented.
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